It is applied in the process technology to improve the contact of grid line electrodes in TOPCon cells, which is located after optical injection of screen-screen printing. Dedicated paste materials are used to reduce the peak temperature of sintering and minimize damage and recombination to the passivation layer, followed by LOCprocess to optimize and improve contact. The equipment can effectively improve the open-circuit voltage and fill factor and enhance photoelectric conversion efficiency, with a gain of over 0.3%.

The laser ablation process technology applied to backcontact (BC) solar cells utilizes an ultrafast laser with a flat-top beam profile to pattern the mask for creating interdigitated P-type and N-type regions, thereby achieving localized doping functionality

The equipment is applicable for the laser process in the mid-to-late stage production line of perovskite solar cell products, including P0 marking, P1/P2/P3 laser scribing, P4 laser insulation edge cleaning, and laser BIPV transparency.

The silk-screen printing line equipment includes processes such as silicon wafer loading, screen printing, drying, sintering, testing, and sorting. As the metallization step for producing electrodes in crystalline silicon solar cells to achieve current output, it has a significant impact on the photoelectric conversion efficiency of solar cells.

The equipment is applicable for single-side cleaning of high-efficiency TOPCon, BC, and HJT solar cells, removing PSG/BSG.

It is mainly used for texturing and cleaning of monocrystalline silicon wafers for solar cells.

It is used for automatic loading and unloading of the solar cell silicon wafer tubular PECVD&PE POLY equipment.