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Screen Printing Production Line Layout
The screen printing line equipment includes processes such as silicon wafer loading, screen printing, drying, sintering, testing, and sorting. As the final step in the production of crystalline silicon solar cells, high requirements are placed on the production capacity, printing accuracy, fragmentation rate, and grading accuracy of the production line equipment.
Overall Technical Parameters
| Whole line CT | 182 silicon wafers ≤ 0.85S, 210 silicon wafers ≤ 0.9S |
| Whole line fragmentation rate | ≤ 0.1% (excluding factors such as silicon wafer quality, hidden cracks, and human operation errors) |
| Whole Line Up; Time | ≥ 98.5% |
| Silicon wafer size | 166-230m |
| wafer thickness | 110-220 μ M |
| Loading method | Silicon wafer feeding machine, or docking with laser film opening machine |
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