TOPCon has become one of the mainstream technical routes for the industrialization of N-type cells, and boron diffusion is mainly used to form PN junctions in cell manufacturing, which is one of the key processes.

It is suitable for the semiconductor and photovoltaic fields.

The LPCVD system offers an all-in-one solution for the preparation of the tunnel oxide and poly-Si layers.

By integrating the thermal oxidation and poly-Si deposition processes into a single step, it significantly boosts throughput.

It is also compatible with both i-Poly and d-Poly growth processes.

The independently developed and designed high-capacity tubular ALD coating machine provides ultra-thin and high-quality dielectric films such as SnOx, AlOx, NiOx, and ZnOx for the manufacturing of high-efficiency solar cells. It cooperates with automation to achieve stable and reliable operation.

It is applied in the micro-etching technology on the back poly layer of TOPCon cells, including the poly doping and poly thinning processes. It improves the contact performance of the rear of the cell and reduces parasitic absorption of long wavelengths, enhancing the photoelectric conversion efficiency with a gain of 3%.

The monolithic marble structure with anti-vibration rigid design ensures the stability of the high-speed engraving system.

The glass remains stationary during laser processing with a flying optics system.

The beam focus and spacing can be adjusted independently and automatically.

Features a self-developed core laser and a completely new optical path design, ensuring stability and reliability.

The mature supporting process ensures stable improvement in module power output.

Compatible with integrated P1/P2/P3/P4 laser processes;

Support for sizes below 400 mm x 400 mm and different thicknesses, capable of processing flexible materials;

Utilization of the research-grade marble structure and high-speed linear motor motion platform, ensuring the system stability, processing precision, and efficiency;

High throughput, low energy consumption.

600 wafers per batch, 13,500 wafers per hour — for 210mm wafers (in 100-wafer cassettes).

720 wafers per batch, 16,000 wafers per hour — for 182mm wafers (in 120-wafer cassettes).

High throughput, low energy consumption.

600 wafers per batch, 13,500 wafers per hour — for 210mm wafers (in 100-wafer cassettes).

720 wafers per batch, 16,000 wafers per hour — for 182mm wafers (in 120-wafer cassettes).