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LF-7528 TOPCon Laser Sintering
Laser Contact Optimization Equipment
Application Field:
It is applied in the process technology to improve the contact of grid line electrodes in TOPCon cells, which is located after optical injection of screen-screen printing. Dedicated paste materials are used to reduce the peak temperature of sintering and minimize damage and recombination to the passivation layer, followed by LOCprocess to optimize and improve contact. The equipment can effectively improve the open-circuit voltage and fill factor and enhance photoelectric conversion efficiency, with a gain of over 0.3%.
Product Features
- Innovative optical transmission system design, with high reliability and stability.
- High precision, efficiency, and productivity.
Basic Parameters
| Item | Technical Indicator |
|---|---|
| Basic Functions | Fully automated laser contact optimization system featuring dual tracks and 4 laser heads for online processing. |
| Laser | 1080 nm continuous-wave laser with 500 W output power and a 2-year warranty. |
| Processing method and spot size | Optional area scan (2000 × 450 μm) or line scan (150 ± 10 μm) |
| Processing Cell Size | 18X mm x 18X mm to 230 mm x 230 mm (compatible with rectangular wafers) |
| Equipment Throughput | Meets the online CT requirement of 0.78 s. |
| Chipping Rate | ≤ 0.02% |
| Bias Voltage | Flexible adjustment of probe position and voltage |
| Efficiency Gain | Increase efficiency by ≥0.3% based on existing optical injection |
| Geometric Accuracy | Positioning accuracy (Pt): ≤ ±25 μm |
| Wafer Inspection | Front inspection industrial camera, ≥ 10 million pixels; rear inspection optional |
| Dust Removal and Filtration Efficiency | Dust removal efficiency > 95%, dust filtration efficiency > 99% |
| Wafer Handling Mode | Supports both online automatic wafer transfer and manual batch |
| Loading Mode | Dual-side or one-side loading/unloading |
| Control System | Programmable Logic Controller (PLC) + Industrial Personal Computer (IPC) |
| User Interface | LCD display, touch operation, online monitoring, permission management, etc. |
| Manufacturing Execution System (MES) | Equipped with the MES information interface |
Sample Effect
PL image without LOC process
