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HPPET18A
Edge Passivation Equipment (ALD)
Application Field:
ALD edge passivation equipment deposits uniform AlOₓ layers with atomic-level precision on complex cell edges, suppressing leakage currents and enhancing stability. Primarily used for TOPCon and BC cell edges, providing conformal and field-effect passivation to improve efficiency.
Product Features
- Large chamber capacity: up to 18,000 wafers per chamber
- Gas inlet uses a spray plate design for uniform distribution
- Removable spray plates allow easy maintenance
- Dual-layer furnace design enhances safety
- Beyond ALD deposition, the system includes an annealing function to improve passivation performance (two deposition chambers plus one annealing chamber)
Basic Parameters
| Item | Technical Indicator |
|---|---|
| Wafer size（mm） | 182-230 (half-cell) |
| Coating type | Al203 |
| Precursor configuration | Trimethylaluminum (TMA，Solar grade)，Water（H2O） |
| Thickness | Adjustable5-40nm |
| Film uniformity | Intra-wafer ≤ 4%, wafer-to-wafer ≤ 4%, batch-to-batch ≤ 3% |
| Deposition | Stacked edge coating |
Batch capacity | ≥ 18,000 wafers per chamber (210 mm half-cells) |
| UP-TIME | ≥98% |
| Breakage rate (without automated loading/unloading) | ≤ 0.03% |
Ultimate vacuum | ≤ 0.08 Torr (~10 pa) |
| Process pressure | 0.5-10 Torr |
| Pipeline airtightness | ≤1x10-7pa.m3/s |
| TMA supply | N₂ carrier / vapor |
| Process temperature | 150-300℃+1℃ |
| Single-point temperature accuracy | ±0.5°C |
| Temperature zones | 3 |
