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HPEP540-6A
PE-POLY
Application Field:
It is suitable for the semiconductor and photovoltaic fields.For TOPCon/BC cells in the photovoltaic filed, PE-POLY equipment prepares an ultra-thin tunneling oxide layer and a highly doped polycrystalline silicon layer on the cell's back. The ultra-thin oxide layer can allow multi carrier electrons to tunnel into the polycrystalline silicon layer, while blocking minority hole recombination, so that electrons are collected by the metal during the lateral transmission in the polycrystalline silicon layer, ultimately greatly reducing the metal contact recombination current.
Product Features
- Multi-temperature zone furnace made of special materials, with customized auxiliary heating, improving the uniformity of the thermal field and the coating, and reducing energy consumption by 5%；
- Patented adaptive furnace door technology with torque balance mode: with a special furnace door design, the door sealing and stability are improved by 40%；
- Patented parallel cooling technology for boat storage, improving cooling effect, shortening cooling time by more than 10%, and improving the cleanliness inside the operating table；
- Patented graphite boat electrode technology: The electrode stems are designed with special materials to improve the stability of the front electrode, and the tail electrode is adjustable outside the furnace tube for easy maintenance. If no chipping, the frequency of failure occurrence per shift is less than 1 per machine；
- Patented active cooling furnace technology, effectively improving temperature uniformity under large tube diameter, thereby improving coating uniformity；
- Dedicated power supply for the poly process & more intelligent program algorithm, greatly reducing defects such as dark cells, and further improving the yield；
- Specially designed poly graphite boat, greatly reducing the risk of conduction, and extending the service life of the boat；
- User-friendly equipment layout, facilitating equipment maintenance and improving equipment up-time.
Basic Parameters
| Item | Technical Indicators |
|---|---|
| Film type | AIO、SiN、SiON 、SiO |
| Loading capacity | 768 pieces/batch (182mm), 616 pieces/batch (210mm), 500 pieces/batch (230mm) |
| Film thickness uniformity | SiOx uniformity: thickness: 1-3nm adjustable, precision :0.1nm, test SiOx thickness with polished wafer Poly uniformity: thickness: 50-200nm adjustable, precision 1nm, test poly thickness with polished wafer In wafer: ≤5%, between wafer ≤5%, between batch ≤4% (>100nm) |
| UP-TIME | ≥98% |
| Operating temperature range | 100~600°C |
| Temperature control | 9-point temperature control, internal and external dual-mode control |
| Heating mode | Automatic slope rise and fast constant temperature function |
| Cooling mode | The latest patented technology, 9-zone section control, active cooling of furnace body |
| Constant temperature zone accuracy and length | ±1°C/3200mm(500°C) |
| Single point temperature stability | <±1°C/4h(500°C) |
| Heating time | RT → 450°C≤30min |
| Temperature control | Dual-mode precision control |
| System ultimate vacuum | ＜3Pa |
| System leak rate | After the pump is stopped and the valve is closed, the pressure rise rate is < 1 Pa/min. |
| Pressure control mode | Fast-adjustment full-automation closed-loop |
| Process control mode | Full automation control of process, multiple safety interlock alarms |
| Human-machine interactive interface | LCD display, touch screen operation, process editing, online monitoring, authority management, team management, CRRU |
| MES/CCRM | Available |
