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LP-752R
Laser Isolation and Passivated Edge Machine
Application Field:
To mitigate severe edge recombination losses in TOPCon cells caused by wafer dicing damage, this process employs laser to pre-isolate recombination channels at the half-cell cutting lines and the front-side edges. This enhances module power output by ≥0.5%.
Product Features
- Features a self-developed core laser and a completely new optical path design, ensuring stability and reliability.
- The mature supporting process ensures stable improvement in module power output.
Basic Parameters
| Item | Technical Specifications |
|---|---|
| Basic Function | Fully automatic laser isolation and edge passivation equipment, dual-track & dual-head, high compatibility with AGV integration |
| Laser Source | 30W self-developed fiber laser, with 1-year warranty |
| Spot Size | 30μm split beam spot |
| Processable Cell Size | 18Xmm × 18Xmm – 210mm × 210mm (Compatible with rectangular wafers) |
| Throughput (Dual-track & Dual-head) | 9000 uph @182mm size; 8600 uph @210mm size |
| Processing Method | High-precision, high-speed galvanometer scanning |
| Breakage Rate | ≤ 0.02% |
| Pattern Accuracy | PT accuracy ≤ ±20μm |
| Wafer Inspection | Front inspection: industrial camera, ≥10 MP; Rear inspection: optional |
| Dust Removal & Filtration Efficiency | Dust removal efficiency > 95%; Filtration efficiency > 99% |
| Loading/Unloading Method | Selectable: both-side or same-side loading/unloading |
| Control System | PLC + Industrial PC |
| User Interface | LCD display, touch operation, online monitoring, access control, etc. |
| MES | Equipped with MES communication interface |
