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HAN'S-ALK16000A-19E-L
Fully Automatic Tank-type Alkaline Polish & Clean System
Application Field:
It is primarily used for the polishing, etching, and cleaning of silicon wafers after diffusion, as well as for the texturing and cleaning of the rear side of bifacial cells.
Product Features
- High throughput, low energy consumption.
- 600 wafers per batch, 13,500 wafers per hour — for 210mm wafers (in 100-wafer cassettes).
- 720 wafers per batch, 16,000 wafers per hour — for 182mm wafers (in 120-wafer cassettes).
- Compatible with various wafer sizes up to 230mm.
- Capable of processing wafers as thin as 120μm.
- Compatible with various additive technologies.
- Enables fast and in-line chemical changeover.
- Compatible with MES and RFID systems, with an optional online weighing function.
Basic Parameters
| Item | Technical Specifications |
|---|---|
| Wafer Size (mm) | 182/210/230 (optional) |
| Uptime | ≥99% |
| Chipping Rate | ≤0.01% |
| Dimensions | 27315×3106×3383(L×W×H) |
| Cassette Loading Capacity | 6 cassettes/batch |
| Max. Lifting Weight | 100kg |
| Capacity | 600 pcs/batch, 13500 pcs/h – 210mm silicon wafers (100 pieces); 720 pcs/batch, 16000 pcs/hour – 182mm silicon wafers (120 pieces); |
| Cleaning Cycle Time | 2.5 min/carrier (user-defined, adjustable) |
| Power Consumption | 310 kW + 144 kW (heater) |
Process Flow
Pre-Cleaning → Alkaline Polishing → Post-Cleaning or O³ Cleaning → Acid Washing → Pre-Dehydration → Drying (For Reference Only)
