Home
LR-754R
Laser Rear Micro-Etching Machine
Application Field:
It is applied in the micro-etching technology on the back poly layer of TOPCon cells, including the poly doping and poly thinning processes. It improves the contact performance of the rear of the cell and reduces parasitic absorption of long wavelengths, enhancing the photoelectric conversion efficiency with a gain of 3%.
Product Features
- Innovative optical transmission system design, with high reliability and stability.
- Equipped with the doping and thinning processes, providing multiple efficiency enhancement options.
Basic Parameters
| Item | Technical Indicator |
|---|---|
| Basic Functions | Fully automatic dual-track, 4-head back-side laser micro-processing system (AGV-compatible, offline). |
| Laser | In-house developed green picosecond laser, 1-year warranty, annual decay < 8% |
| Spot Size | Beam spot: 400 × 100 μm rectangular flat-top (customizable) |
| Processing Cell Size | 18X mm x 18X mm to 230 mm x 230 mm (compatible with rectangular wafers) |
| Equipment Capacity | 9000 uph/200 grid lines @ 182 mm |
| Processing Mode | High-precision high-speed galvanometer scanning |
| Chipping rate | ≤ 0 . 0 2 ％ |
| Efficiency Gain | 0.15% |
| Geometric Accuracy | PT accuracy ≤ ±15 μm;Line spacing accuracy ≤ ±10 μ m |
| Wafer Inspection | Front inspection industrial camera, ≥ 10 million pixels; rear inspection optional |
| Dust Removal and Filtration Efficiency | Dust removal efficiency > 95%, dust filtration efficiency > 99% |
| Loading Mode | Dual-side or one-side loading/unloading |
| Control System | Programmable Logic Controller (PLC) + Industrial Personal Computer (IPC) |
| User Interface | LCD display, touch operation, online monitoring, permission management, etc. |
| Manufacturing Execution System (MES) | Equipped with the MES information interface |
