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MLCXXXX-L Series
Solar Cell Nondestructive Laser Cutting Machine
Application Field:
In high-efficiency module production, high-precision cutting processes for half-cell and multi-split technologies have been realized. In high-efficiency cell manufacturing, simultaneous half-cell/multi-split cutting and edge passivation are performed, effectively reducing carrier recombination at the edges through passivation layers. This enhances cell conversion efficiency, mechanical strength, and weather resistance. The system is compatible with advanced high-efficiency cell technologies such as XBC (interdigitated back contact) and HJT (heterojunction), enabling non-contact, damage-free processing at both the silicon wafer and semi-finished cell stages.
Product Features
- Excellent equipment compatibility and comprehensive functionality: compatible with multiple high-efficiency cell technologies including TOPCon, HJT, and XBC, as well as various cell sizes and thicknesses for non-destructive cutting. The system can be upgraded to support triple to sextuple slicing, with multiple loading and unloading interface options. Additional functions such as PL inspection, orientation rotation, and precise sorting are also available.
- High efficiency and yield: the equipment achieves a production capacity of up to 14,000 pieces per hour (full cells) with a breakage rate as low as 0.02%.
Instance Effect
Cell front side effect
Crystalline silicon section effect
Section effect
Cell cutting surface micrograph
Basic Parameters
| Equipment Type | Technical Indicator |
|---|---|
| Basic function | Supports dual- and triple-slicing, with optional upgrade to quadruple–sextuple slicing. |
| Cutting function | Cut one into two or three pieces |
| Cell size | 156x156~230x230, thickness 120~300µm |
| Chipping rate | ≤0.2% |
| Operation rate/fault rate | ≥99%, fault rate≤1% |
| Mean laser power | Laser for grooving ≥50w, laser for cutting ≥300w |
| Laser lifetime | ≥30000h, warranty 20000h |
| Cutting process for grooving | Adjustable cutting depth, single side line length of grooving≤2mm |
| Cutting process for splitting | No heat-affected zone, no microcracks, no damage to cell surface |
| Cell specification compatibility | Regular dual-sided PERC, TOPCon cell, HJT (Heterojunction) cell |
| Loading & unloading detection | Industrial camera, ≥20 million pixels, with NG (non-good) rejection |
| Custom function | Material code scanning, busbar positioning, material overturn, PL detection, precise material-in, centralized feeding or AGV docking and other functions are optional |
| Power supply | 380V/50Hz/12kW (max. power consumption) |
| Compressed air | 0.5~0.8MPa，600LPM |
| Equipment size | L4000xW1750xH2150（mm） |
