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HBDS480-6A
Low Pressure Diffusion System
Application Field:
TOPCon has become one of the mainstream technical routes for the industrialization of N-type cells, and boron diffusion is mainly used to form PN junctions in cell manufacturing, which is one of the key processes.
Product Features
- The furnace body is specially designed for high temperature process (900~1100 °C), effectively preventing the deformation and prolonging the service life;
- The advanced full closed-loop pressure control system can accurately detect and control the air pressure in the process chamber in real time;
- High-efficiency tail gas treatment system can separate dry and wet gas and automatically discharge gas, greatly extending the maintenance cycle, reducing maintenance costs, and ensuring the operating rate and process stability;
- The unique sealing design of the furnace door realizes the isolation of the metal and the reaction chamber, reduces heat loss, greatly prolongs the service life of the sealing ring, and ensures the stability of the pressure;
- MES/CCRM system with complete architecture and outstanding performance.
Basic Parameters
| Item | Technical Indicators |
|---|---|
| Silicon wafer size | 82-230mm optional |
| Process mode | Closed-tube low pressure diffusion |
| Effective inner diameter of reaction tube | Ø480mm |
| Loading capacity | 1680-2880 pieces/batch@182mm (slot spacing 2.72mm), 2200 pieces/batch@210mm (slot spacing 3.15mm) |
| Square resistance and uniformity | In wafer≤5% ,Between wafer ≤5% ,Between batch ≤3% (50~110ohm/sq) |
| Heating temperature | Rt → 1250°C |
| Operating temperature range | 600~1100°C |
| Temperature control | 7-point temperature control, internal and external dual-mode control |
| Heating mode | Automatic slope rise and fast constant temperature function |
| Max. cooling rate | ≥7℃/min（1100~900℃）, ≥6℃/min（900~700℃) |
| Constant temperature zone accuracy and length | ≥0.5℃/2800mm ( 600~1100℃ ) |
| Single point temperature stability | ≤±0.5℃/4h（880℃） |
| Boat feeding mode | Using SiC cantilever boat to automatically feed wafer in horizontal direction, Boat speed 20~1500mm/min continuously adjustable, positioning precision ≤±1mm |
| System ultimate vacuum | 20mbar |
| System leak rate | After the pump is stopped and the valve is closed, the pressure rise rate is < 1 mbar/min |
| Pressure control | Closed-loop full-automation |
| Process control mode | Full automation, PLC+IPC, touch screen operation |
| Human-machine interactive interface | LCD display, touch screen operation, process editing, online monitoring, authority management, team management, CRRU |
| MES | Optional |
